IBM have announced that they have begun shipping the “Broadway” CPU from their manufacturing facility in East Fishkill, N.Y., to Nintendo to be placed under the hood of the soon to be released Nintendo Wii.

Silicon on Insulator technology will help deliver an improvement in processing power, while achieving a 20 percent reduction in energy consumption compared to the previous chip, codenamed ‘Gekko’.

“The first chips are in our possession,” said Genyo Takeda, Senior Managing Director/General Manager, Integrated Research & Development Division, Nintendo Co., Ltd. “Today’s milestone marks the final stage of our drive to reach both core and nontraditional gamers with an inviting, inclusive and remarkable gaming experience.”

CMON Nintendo, Wii can’t wait !

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